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FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating

FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating

  • Resaltar

    Fast Deposition Copper Plating Chemicals

    ,

    Stable Process Electroplating Copper Plating Chemicals

    ,

    Environment Friendly Chemical Auxiliary Agent

  • Tipo
    Abrillantador
  • Artículo
    Agente auxiliar químico
  • Usar
    Cobrizado
  • Característica
    Deposición rápida, proceso estable
  • característica
    Sin cianuro
  • Nombre
    Productos químicos para el revestimiento de cobre por electroplacado
  • Lugar de origen
    PORCELANA
  • Nombre de la marca
    FENGFAN
  • Número de modelo
    FF-5100
  • Cantidad de orden mínima
    Negociable
  • Precio
    Negociable
  • Detalles de empaquetado
    Embalaje de exportación estándar
  • Tiempo de entrega
    15-25 días de trabajo
  • Condiciones de pago
    L/C, D/A, D/P, T/T, Western Union, Moneygram
  • Capacidad de la fuente
    200000pcs/día

FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating

FF-5100  Non - cyanide alkaline copper plating process


FF-5100 Non - cyanide alkaline copper plating is environment friendly, which can meet the environmental requirements of the electroplating industry .

 

1. Features

1.1   Non-cyanide, suitable for direct copper plating for iron and steel substrate, also suitable for aluminum alloy and zinc alloy.

1.2   Has excellent dispersion and coverage, coating fine, smooth, soft and a certain brightness.

1.3   Single component supplement, simple operation , wide temperature range, can be at 40 ~ 50 .

1.4   Coating surface is not hydrophobic, without removing the film, can be directly plated with nickel or other metals.

 

2. Solution composition and process parameters

2.1 Process Flow:

Pre-treatment washing washing acide activation washing washing copper plating(FF-5100) Washing   Post-processing

 

2.2 composition of plating solution  

 

composition

range

optimal

FF-5100 M

400~600ml/L

500 ml/L

Temperature

40~55

50

PH

9~10

9.5

Cathode current density

1.0~3.0 A/dm2

2.0 A/dm2

Cathode current density(barrel plating)

0.5~2.0 A/dm²

1.0 A/dm²

Anode

Electrolytic copper

Electrolytic copper

Anode area: cathode area

1:1

11~2

Filter

continuous

continuous

Agitate

Air or mechanical agitation

Air  agitation